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TVS Diode Arrays (SPA ? Diodes)
Low Capacitance ESD Protection - SP3012 Series
Top View
D
E
A
B
D
A1 A3
μ DFN-10 (2.5x1.0x0.5mm)
b1
MO-229
b
Package Dimensions—μDFN-10 (2.5x1.0x0.5mm)
Top View
A
Package
JEDEC
Symbol
A
Min
0.48
0.05 C
Seating
Plane
C
Millimeters Inches
A
Side View
M C
M C
Nom Max Min 0.10 Nom A B Max
0.515 0.55 0.019 0.05 0.020 0.021
0.05 C
A1
0.00
--
0.05
0.000
0.022
Bottom View
R0.125
E
A3
b
b1
0.15
0.35
0.125 Ref
0.20
0.40
0.25
0.45
0.005 Ref
0.006 0.008
0.014 0.016
0.012
0.018
0.05 C
Seating
Plane
C
A
Side View
b1
b
0.10 M C A B
0.05 M C
B
A1 A3
0.05 C
D 2.40 2.50
E 0.90 1.00
e 0.50 BSC
L 0.30 0.365
Soldering Pad Layout Dimensions
Inch Millimeter
(0.034)
(0.875)
C
0.008
0.20
G
0.020
0.50
P
0.039
1.00
P1
2.60
1.10
0.43
0.094 0.098 0.102
0.035 0.039 0.043
L
0.020 BSC
(7x) 0.014
0.012 2xR0.075mm 0.016
e
Recomended
Soldering Pad Layout
P1
P
Y
(Y1)
Z (C) G
X
0.008
0.20
Bottom View
R0.125
X1
Y
Y1
0.016
0.027
(0.061)
0.40
0.675
(1.55)
X
X1
L
Z
0.061
1.55
Alternative
Soldering Pad Layout
P1
e
2xR0.075mm (7x)
Z (C) G
P
Y
(Y1)
Recomended
Soldering Pad Layout
P1
P
Embossed Carrier Tape & Reel Y Speci?cation— μDFN-10
(Y1)
Z (C) G
X
X1
P1
P2
X
P0
X1
T
User Feeding Direction
Package
Symbol
A0
μ DFN-10 (2.5x1.0x0.5mm)
Millimeters
1.30 +/- 0.10
B0
D0
2.83 +/- 0.10
? 1.50 + 0.10
D1
A0
5o Max
5o Max
Pin 1 Location
D1
E
F
K0
? 1.00 + 0.25
1.75 +/- 0.10
3.50 +/- 0.05
0.65 +/- 0.10
P0
P1
P2
T
W
4.00 +/- 0.10
4.00 +/- 0.10
2.00 +/- 0.05
0.254 +/- 0.02
8.00 + 0.30 /- 0.10
SP3012 Series
6
?2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 09 2, 13
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